Quote by punchuintheeye:
i build electronics for a living and while solder joint failure is likely, its not from overheating. The temp of the joint would have to reach at least 650 degrees. I just dont believe the xbox gets that hot inside. They are a class 1 product which is basically a fancy way of saying this product does not meet exceptional standards and most likely will fail. It would also have to be about 650 degrees for 5-10 mins to make the mother board warp. The board is not plastic, its multilayer Fiberglas and copper. Ive seen the inside of an xbox and it looks like a 5 year old soldered it. Basically its a cheap peice of shit that has a very high failure rate. You could open it up and touch up all the solder joints yourself. That would make it alot more reliable, unless you dont know what your doing.
You're right to say the chips don't get hot enough to melt the solder and blaming it on a design flaw is absolutely correct.
The overheating isn't making the solder melt, it is exposing the weakness of cold solder joints and lead-free solder that Microsoft used to attach the chips to the mobo. The chips only reach around 220F before the console will shut down, so it would be foolish to think the solder would liquefy at running temps. The problem is that even at that reletively low temp, the bad joints that previously existed deteriorate with dirt dust and other junk.
The mobo warp is also due to the design flaw of the cheap X-clamps used to try to force the chip and board up against the heat sinks. Once again, you're right, operating temperatures alone will not cause mobo warpage, but coupled with the lateral stress from the clamps, it flexes enough to strain the joints.
I would go on record as saying that if MS used well done lead based solder joints, they would've most likely had less than 1/10 as many failures.